SK Hynix Negotiates 2027 HBM Supply and Pricing with Key Customers

SK Hynix is finalizing 2027 HBM contracts with major clients, citing strong demand. Pricing models now factor in advanced packaging and process costs beyond standard DRAM metrics.

Woofun AI reports that SK Hynix confirmed ongoing negotiations with a key customer regarding 2027 HBM supply volumes and pricing during its Q2 2026 earnings call. The company stated that discussions are progressing smoothly amid robust demand, though specific contract terms remain undisclosed. SK Hynix emphasized that HBM pricing is no longer tied solely to traditional DRAM rates but incorporates factors such as wafer costs, advanced processes, TSV, packaging, capacity investment, and technological complexity. Each customer agreement will be negotiated individually. The firm intends to leverage its technological and cost advantages to sustain profitability in the HBM sector while fostering long-term partnerships within the AI ecosystem.