SK hynix and SanDisk Launch HBF Standard with 3TB/s Bandwidth

SK hynix and SanDisk release HBF spec via OCP, targeting AI memory wall with 512GB capacity. Market rebounds as infrastructure focus shifts to storage efficiency.

Woofun AI reports that SK hynix and SanDisk released the first High Bandwidth Flash (HBF) standard specification through the Open Compute Project on August 4, showcasing solutions at FMS 2026 in Santa Clara. Positioned between HBM and SSD, HBF utilizes NAND technology to offer up to 512GB capacity and bandwidth ranging from 0.4TB/s to 3.0TB/s, aiming to resolve AI inference memory bottlenecks. The standard employs UCIe interconnection for flexible integration with GPUs and CPUs, with Google and Tenstorrent joining the HBF Alliance to foster an open ecosystem.

SK hynix also unveiled its 10th generation 375-layer 4D NAND wafer, citing a 2.5x increase in performance per watt over the previous generation. Mass production of high-performance eSSDs based on this technology is planned for early next year. This development coincides with a recovery in chip stocks after July declines, as market attention shifts toward systemic performance metrics like memory bandwidth and data movement efficiency in AI infrastructure.