Samsung and SK Hynix HBM R&D Spending Surges to Record Levels

Samsung hits record $11.6B Q2 R&D spend for HBM4/DDR5 expansion. SK Hynix targets $32.6B capex for HBM5 and hybrid bonding tech.

Woofun AI reports that Samsung Electronics recorded a record 16 trillion won ($11.6 billion) in R&D investment for the second quarter, directing funds toward high-end storage production including HBM4, HBM4E, and DDR5. SK Hynix is concurrently advancing next-generation technologies such as HBM5, hybrid bonding, and iHBM, with capital expenditure plans set at 40 trillion won ($32.6 billion) for the current year.